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DesignCon is a trade show focused on electronic product design, electronic components as well as the applications that drive demand for electronics. It has been going on for decades in Silicon Valley. The in-person conference included three engaging keynotes. John Bowers, Frad Kavli Chair of Nanotechnology, from UCSB talked about how photonics could be used in high-capacity co-packaged electronics. Laurence Moroney, Artificial Intelligence Lead at Google talked about practical applications for AI and Machine Learning. Jose Morey, Consultant for NASA, IBM, Hyperloop Transportation and Liberty BioSecurity; gave an inspiring talk on mankind’s future in space, curing old age and a future enabled by robots.

John Bowers showed the future evolution of co-packaged optics and electronic chips for data center communication as shown below. True co-packaging will require chip stacking and heterogeneous integration of various types of chips, including optical engines. The PIPES project that UCSB is involved with is building technology for 10 Tbps links with 0.5pJ/bit efficiency that includes technology such as quantum dot lasers.

Electronic products need memory and storage to work and there were several sessions at DesignCon that explored how storage and memory is evolving to meet the needs of current and future products. As shown in the image from Rambus talks below, memory technology is evolving to provide higher bandwidth, capacity and new more efficient and secure computer architectures, driven by new interconnects (e.g. CXL) and data center disaggregation.

Read more: 2022 DesignCon Shows Evolution Of Electronic Chip Communication And Memory